Next-Generation of Electronics Will Include an Interconnect Insulator
a -BN sample grown on a Si substrate at T= 673K. Atomic species are shown in different colors: Si (yellow), Blue (N), Pink 3 (B) UNIST, SAIT, University of Cambridge, Catalan Institute of Nanoscience and Nanotechnology
In the ongoing process of miniaturization of logic and memory devices in electronic circuits, reducing the dimensions of interconnects –metal wires that link different components on a chip– is crucial in order to guarantee fast response of the device and improve its performance.
